EV Group (EVG), a number one provider of wafer bonding and lithography gear for the MEMS, nanotechnology and semiconductor markets, as we speak introduced that it has expanded its collaboration with the Industrial Know-how Analysis Institute (ITRI), one of many world’s main utilized know-how analysis institutes based mostly in Hsinchu, Taiwan, on growing superior heterogeneous integration processes.
With the assist of the Division of Industrial Know-how (DoIT) of the Ministry of Financial Affairs (MOEA), Taiwan, ITRI established the Heterogeneous Integration Chip-let System Bundle Alliance (Hello-CHIP) to assist create an ecosystem protecting package deal design, testing and verification, and pilot manufacturing, to attain the purpose of provide chain localization and broaden enterprise alternatives. As a member of the Hello-CHIP Alliance, EVG has supplied a number of of its most superior wafer bonding and lithography techniques, together with the LITHOSCALE® maskless publicity lithography system, EVG®850 DB automated debonding system, and GEMINI®FB hybrid bonding system. The set up of those high-volume-manufacturing platforms at ITRI’s state-of-the-art facility will assist allow EVG’s and ITRI’s shared prospects to speed up the event and switch of latest heterogeneous integration processes from R&D to prospects’ fabs.
In semiconductor manufacturing, 3D vertical stacking and heterogeneous integration – the manufacturing, meeting and packaging of a number of completely different elements and dies right into a single gadget or package deal – are more and more vital for greater efficiency past transistor scaling. 3D and heterogeneous integration are enabling high-bandwidth interconnects in superior packaging to attain general system efficiency beneficial properties, and thus have develop into a vital driver for synthetic intelligence (AI), autonomous driving and different high-performance computing purposes. Because of this, the MOEA is proactively following up and bridging the sources with national-scale R&D initiatives corresponding to “AI Chip Heterogeneous Built-in Module Superior Manufacturing Platform” and “Programmable Heterogeneous 3D Integration”.
In line with Dr. Robert (Wei-Chung) Lo, Deputy Common Director of Digital and Optoelectronic System Analysis Laboratories at ITRI, “As a part of ITRI’s mission to drive industrial improvement, create financial worth, and improve social well-being by way of know-how R&D, we centered on growing new 3D and heterogeneous chip integration processes and forging shut cooperation throughout the availability chain to allow continued improvement and progress of the semiconductor business. Having the identical absolutely automated high-volume-manufacturing techniques in our analysis facility that our prospects have of their fabs, together with these new wafer bonding and lithography options from EV Group, permits our prospects to instantly switch course of recipes developed at ITRI to their very own fabs – offering quick ramp-up time from lab to fab.”
“Key to our Triple-i philosophy of invent-innovate-implement is our deal with participating with world-leading analysis institutes, like ITRI, to speed up the event and commercialization of latest applied sciences that drive future improvements within the semiconductor business,” acknowledged Hermann Waltl, government gross sales and buyer assist director and member of the chief board at EV Group. “Our ongoing collaboration with ITRI provides us entry to world-class analysis experience and additional enhances our course of assist infrastructure in Taiwan, which EVG has considerably expanded through the years to raised meet the rising wants and challenges that our prospects and companions within the area face. This consists of our distinctive course of and utility engineering group based mostly in a number of areas throughout Taiwan, which enhances the providers supplied at EVG’s Heterogeneous Integration Competence Middle at our headquarters in Austria.”